The FastStar series epoxy die bonder is a high-speed and high-precision equipment for multi-chip packaging, with an accuracy of ±7μm@3σ. It adopts open architecture and modular design, which can provide on-demand customization capability with extreme efficiency, and is compatible with up to 12-inch wafers to meet the encapsulation process of solidification, SiP, UV curing and other packaging processes.
The DU9721 epoxy die bonder can achieve accuracy of ±7μm@3σ through its self-developed motion control technology. the device, through the integration of dispensing, automatic tool change, and lamination, is Compatible with multi-size wafers.
Equipment accuracy | ±7μm@3σ |
| Bonding Force | 20–500g (programmable) |
Angular Accuracy | ±0.2° @ 3σ |
Achieve ultimate bonding efficiency
Support wafer, waffle pack, gel pack, and feeder feeding;
Support die bonding on substrate, boat, carrier, PCB, leadframe, and wafer;
Support epoxy, soldering;
Support packagingtechnologies including Die attach, Flip chip, and SiP
Die bonder, flip chip bonder, and multi-chip packagingin one machine
Compatible withdifferent categories of development needs
Support multiple feeding methods,and can be customized production lines according to customer requirements
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Official video Number
No.666, Huxin Road, Wujiang District, Suzhou, Jiangsu, China 
