The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (12-50s/pcs) and high precision (±0.5~±3μm) . This series serves functions of eutectic bonding, dipping glue bonding and Flip Chip bonding. It is also able to meet the needs of multi-chip bonding. Its modular design enables the equipment to have highly flexible manufacturing capability. Also, equipped with an intelligent calibration and data management system, the MicroStar Series is capable to trace and manage process.
The EH9722 eutectic die bonder can provide All in one integrated solution. At the same time, it can be equipped with eutectic, adhesive dipping, adhesive dispensing, UVcuring and other placement processes
Placement accuracy | ±1.5μm @ 3σ |
| Placement process | Eutectic/ Adhesive dipping/ dispensing /UV/Flip Chip |
Efficiency | 40-50s (Eutectic)15-20s (Adhesive dipping) |
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No.666, Huxin Road, Wujiang District, Suzhou, Jiangsu, China 
