The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (12-50s/pcs) and high precision (±0.5~±3μm) . This series serves functions of eutectic bonding, dipping glue bonding and Flip Chip bonding. It is also able to meet the needs of multi-chip bonding. Its modular design enables the equipment to have highly flexible manufacturing capability. Also, equipped with an intelligent calibration and data management system, the MicroStar Series is capable to trace and manage process.
The EF8622 eutectic die bonder is mainly used in COC and COS process scenarios, providing high-precision mounting and multi feeding modes to solve customer pain points such as low yield and low production.
Placement accuracy | ±1.5μm @ 3σ |
| Placement process | Eutectic/ Adhesive dipping |
Efficiency | 25-35s (Eutectic)12-15s (Adhesive dipping) |
High precision
The repeated accuracy of the mounting air flotation platform is 0.5μm
High efficiency of eutectic
Twin eutectic platform
（The eutectic temperature between 200 and 340 ℃ only takes 3.2s to rise, and the cooling between 340 and 200 ℃ only takes 6.5s）
Dynamic tool change
12 tool change chucks fully automatic tool change
Dual view module
Free switching of high and low magnification lenses (1&5x)
Wechat scan
Official video Number
No.666, Huxin Road, Wujiang District, Suzhou, Jiangsu, China 
