The CesiStar Series AOI provides high performance, fully automated optical inspection of packaged integrated circuit(IC) components. It leverages high sensitivity with 2D/3D inspection and measurements to determine final package quality for a wide range of device types and sizes.
The CesiStar TV6-15T mainly applies QFN,QFP,FCBGA and other products, we provide customers with efficient and high-quality chip six-sides optical testing with ultra-high detection accuracy.
3D rep/acc | 7.5μm |
| Device Size | 3x3mm-50x50mm |
Chip packaging type | BGA/QFN/QFP |
High precision 3D measurement
The accuracy and repeatability up to 7.5um
High performance and easy to operate software
Create a new recipe<1H
Fast product changeover time
＜ 20 min
Intelligent defect classification function
Intelligent defect classification algorithm engine
Wechat scan
Official video Number
No.666, Huxin Road, Wujiang District, Suzhou, Jiangsu, China 
