The CesiStar Series AOI provides high performance, fully automated optical inspection of packaged integrated circuit(IC) components. It leverages high sensitivity with 2D/3D inspection and measurements to determine final package quality for a wide range of device types and sizes.
The CesiStar TV6-10T mainly applies advanced processes such as FCBGA, Memory and POP are equipped with high-precision micro crack and TOP 3D detection modules, providing quality assurance for advanced packaging customers.
3D rep/acc | 5μm |
| Device Size | 2x2mm-120x120mm |
Chip packaging type | BGA/POP/Memory |
High precision 3D measurement
The accuracy and repeatability up to 5um
Comprehensive detection function
6 sides, Top 2D/3D, Bottom 2D/3D, Micro Crack, Passive component detection
Modular configuration
Equipped with TOP 3D and high-precision microcrack module
Intelligent defect classification function
Intelligent defect classification algorithm engine
Wechat scan
Official video Number
No.666, Huxin Road, Wujiang District, Suzhou, Jiangsu, China 
